The latest firmware release 23.07 of Roboception’s rc_reason software has some new features and improvements like detection of multiple load carriers in a scene, detection of stacked objects in SilhouetteMatch (pilot phase), automated generation of 3D models when uploading .dxf files in SilhouetteMatch and improved network settings.
Sick expands its Ruler3000 family with the launch of three compact cameras, as well as an additional mid-range variant.
Mech Mind Robotics Mech-Eye LSR S is an upcoming laser camera for medium-range in- and outdoor applications.
Photoneo releases Locator Studio 1.1.0 – the new version of the company’s 3D picking tool for localization and picking of oriented and semi-oriented items in collision-free environments.
Vzense’s DS series, DS86 and DS87, are industrial-grade depth cameras based on Sony CW iToF chip technology.
Mech Mind Robotics announces the 3D laser profiler Mech-Eye LNX 8000 series with 4K resolution and a scan rate up to 15kHz.
The AI-powered solutions ‘Depalletization & Delayering’ of Photoneo is for automated pallet unloading.
The 3D ultrasonic sensor Echo One by Toposens / Meyens enables mobile robots such as AGV and AMR to avoid collisions with all kinds of obstacles.
Photoneo releases the 3rd generation of their Ambient Light Suppression (ALS) technology, which allows users to scan outdoors under direct sunlight (equivalent to 100,000 lux), indoors with irregular & changing lighting conditions, the darkest & brightest areas of a scene simultaneously in a single scan and under challenging lighting conditions even when capturing large objects with glossy surfaces.
The combined 2D/3D surface inspection by IMS was installed for the first time in a pickling plant in November 2021 at Thyssenkrupp Rasselstein in Andernach, the world’s largest production site for packaging steel.
The compact 3D cameras Sizector M051040 of Mega-Phase has a resolution of 2472 x 2065 and a FOV of 40 x 33,4mm.
Inuitive designs multi core processor ICs that serve as the vision processor for smartphones, AR/VR devices as well as robots.
The Zivid 2+ is is both a 3D and a 2D camera designed for reliable high-speed piece-picking of all inventory items.
Delta’s high-speed DMV-T time of flight (ToF) smart camera offers a high capture speed of up to 60fps, large scanning distance up to 6m.
With the newest firmware update, all Photoneo 3D cameras running on firmware 1.10 are fully compatible with GigE Vision 2.1.
With the 3D camera Mech-Eye Deep, Mech-Mind has expanded its product portfolio for measuring larger volumes in logistics with high accuracy.
OPT presents the one-click measurement sensor SmartFlash at Control fair.
Arrow Electronics’ compact (25.0×70.7mm) CYC5000 FPGA board with Arduino-compatible header simplifies the development of IoT edge devices using programmable logic, RISC-V with Altera’s Nios V, DSP accelerators and hardware -IP blocks.
Basler is expanding its product portfolio to include the Stereo visard 3D camera series.
The Fraunhofer Development Center for X-ray Technology, a division of Fraunhofer IIS, has presented a novel testing option for batteries in electric vehicles.
Avnet is presenting two high-end Computer-on-Modules (CoMs) with Intel Core Ultra processors for computing and graphics-intensive applications.
The new addition of Brighter AI´s software is a Full Body Blur feature.
Pekat Vision announces a collaboration with Baumer, introducing the Baumer VAX-50 Smart Camera with the Pekat Vision software.
The new Turtle housing series from autovimation guarantees IP65 protection (IP54 fan) for all camera models up to 100x100mm cross section and lenses up to 120mm diameter, with simultaneous Peltier air conditioning up to +70°C ambient temperature.
At Control, Genesi Elettronica is presenting various programmable multispectral LED lighting systems that work with up to twelve different wavelengths in the range from 400 to 1,650nm.
The Imaging Source announces the launch of IC Measure 4 for Windows.
Euresys introduces the four connection Coaxlink Quad CXP-12 DF frame grabber with Data Forwarding.
Teledyne e2v’s Topaz5D full HD CMOS image sensor combines 2D vision with 3D depth information.
