With the multicode reader O2I, ifm shows how IO-Link can be used in image processing.
With the multicode reader O2I, ifm shows how IO-Link can be used in image processing.
AioT computing provider Advantech announces the series production of the flexible native AI/KI system-on-module SOM-6884.
With the Foreign Object Detection System (FOS), Sick presents a system solution for minimizing process errors in the assembly of high-voltage batteries.
Balluff’s industrial 3D imaging system RadarImager is based on terahertz technology and examines various types of packaging.
Prophesee’s GenX320 Event-based Metavision sensor is specifically developed for integration into ultra-low-power Edge AI vision devices.
Framos’ FSM IMX636 Development Kit is a platform that allows developers to explore the capabilities of EVS (Event-based Vision Sensing) technology and test potential benefits of Nvidia Jetson technology with the Framos sensor module ecosystem.
The VC MIPI IMX585 camera of Vision Components is based on the Sony Starvis-2 IMX585 image sensor and offers an image resolution of 8.4MP, 4K and HDR support.
Wenglor offers the MLSL1xxS50 laser triangulation sensor for high precision in inline measurement of the bending angle.
Deltas´ DMV-T time of flight (ToF) smart camera offer 60fps, large scanning distance up to 6m and is the first software-defined 3D ToF camera in the market.
Imago’s Industrial DashCam 1000 monitors the operation of machines and technical equipment in real time.
Speck is an event-driven neuromorphic vision system-on-chip (SoC), combining the iniVation Dynamic Vision Sensor with SynSense spiking neural network technology.
The Wenglor Discovery Tool is a software for searching and finding Wenglor Machine Vision devices in the network – independent of the network configuration of the system or the PC.
Efinix´s Titanium Ti180 J484 Development Kit has everything to develop and prototype designs for the Ti180 FPGA.
Lanner´s PCIe AI accelerator card Falcon H8 has integrated four to six Hailo-8 AI processors to offload CPU loading for low-latency deep learning inference.
The Euresys Deep Learning Bundle complements a number of image processing and image analysis libraries that are regularly used by users.
The Fluke Process Instruments ThermoView TV30 thermal imaging camera has a measurement temperature range of -10 to +1,300°C.
Hamamatsu Photonics Europe C16741-40U is an InGaAs camera with sensitivity in the visible to near infrared region from 400 to 1700nm.
OPT presents the one-click measurement sensor SmartFlash at Control fair.
Arrow Electronics’ compact (25.0×70.7mm) CYC5000 FPGA board with Arduino-compatible header simplifies the development of IoT edge devices using programmable logic, RISC-V with Altera’s Nios V, DSP accelerators and hardware -IP blocks.
Basler is expanding its product portfolio to include the Stereo visard 3D camera series.
The Fraunhofer Development Center for X-ray Technology, a division of Fraunhofer IIS, has presented a novel testing option for batteries in electric vehicles.
Avnet is presenting two high-end Computer-on-Modules (CoMs) with Intel Core Ultra processors for computing and graphics-intensive applications.
The new addition of Brighter AI´s software is a Full Body Blur feature.
Pekat Vision announces a collaboration with Baumer, introducing the Baumer VAX-50 Smart Camera with the Pekat Vision software.
The new Turtle housing series from autovimation guarantees IP65 protection (IP54 fan) for all camera models up to 100x100mm cross section and lenses up to 120mm diameter, with simultaneous Peltier air conditioning up to +70°C ambient temperature.
At Control, Genesi Elettronica is presenting various programmable multispectral LED lighting systems that work with up to twelve different wavelengths in the range from 400 to 1,650nm.
The Imaging Source announces the launch of IC Measure 4 for Windows.
Euresys introduces the four connection Coaxlink Quad CXP-12 DF frame grabber with Data Forwarding.