The AI-controlled Leo 3D scanner is a wireless and fully self-contained device by Artec that integrates an Nvidia Jetson TX2 processor, a 5-inch HD display and a battery.
The AI-controlled Leo 3D scanner is a wireless and fully self-contained device by Artec that integrates an Nvidia Jetson TX2 processor, a 5-inch HD display and a battery.
At Formnext, IBS Quality, together with Verisurf Software, Aesub and Eleven Dynamics, will present the complete 3D scanning process chain with the PAM system, a mobile scanning and inspection solution complemented by an intelligent software concept.
B&R is adding Deep Learning capabilities to its smart camera portfolio thanks to a collaboration with MVTec and AI processor specialist Hailo.
Anyline’s Tire Tread Scanner works by simply pointing the camera of a smartphone or any standard mobile device at the tire tread to be measured.
Matrix Vision’s BVS 3D-RV1 3D camera, with its 12MP sensors, achieves a level of capture accuracy that is especially necessary for handling small and complex parts in a wider field of view.
The C6040 ultra-compact IPC by Beckhoff has integrated 12th generation Intel Core processors with up to 16 cores.
Building on the Zynq UltraScale+ MPSoCs and Artix UltraScale+ FPGAs, AMD Xilinx adds two new devices to the UltraScale+ family.
Allied Vision integrates the Sony IMX global shutter sensors of the 1st Pregius generation into its Alvium cameras.
Ultron is a Nvidia Jetson-powered Sensor Fusion System of Smartcow that brings high computing power to the edge for applications.
Efinix released the TinyML platform for AI acceleration on its range of FPGAs.
Teledyne Dalsa’s Genie Nano-10GigE M/C8200 and M/C6200 cameras are based on Teledyne e2v’s 67M and 37M monochrome and color sensors and consist of four models with 37 and 67MP resolution.
The Vial Scanner by Schäfter+Kirchhoff (www.sukhamburg.com) was developped for the in-situ imaging of Drosophila pupae and for automated measurement of their size.
Autovimation now offers two new enclosure variants for the FX10 and FX17 hyperspectral imaging cameras from Specim: In addition to the IP 66/67 enclosures previously supplied, a stainless steel version (V4A stainless steel) in hygienic design and a climate-controlled version are now also available.
Euresys has announced the Grablink Duo. The camera link frame grabber enables the connection of two independent CL cameras with base configuration or one CL camera with base, medium, full, 72bit or 80bit configuration.
Bitflow introduce its first CoaXPress-Over-Fiber (CXPoF) frame grabber Claxon Fiber.
Creaform’s VXintegrity NDT software platform enables the assessment of surface damage.
The main feature of the new Halcon version 23.05 by MVTec is Deep Counting, a Deep Learning based method that can count large amounts of objects.
Qioptiq Excelitas releases MachVis 5.4, a new version of its software for selecting and configuring objectives and optomechanical imaging systems.
The IDC200 multicode reader by Baumer with internal illumination can process up to 40fps, even with different code types.
Series production of the new uEye+ Warp10 camera models by IDS will start in April.
With a casing of only 50x50mm, the new FXO camera by SVS Vistek is currently the most compact industrial camera with two CoaXPress-12 connections.
Euresys has announced the Coaxlink Quad CXP-12 Value, a CXP-12 frame grabber with four CoaXPress CXP-12 ports (5,000 MB/s camera bandwidth), PCIe 3.0 (Gen 3) x8 bus (6,700 MB/s bus bandwidth), a host of features including 20 digital I/O ports and extensive camera control capabilities, and the Memento event logging tool.
The challenge with CT is to scan as many test parts as possible at once.
With the launch of the Zeiss Advanced Reconstruction Toolbox (ART) 3.0, the company offers an AI Supercharger package with the all-new DeepScout as well as DeepRecon Pro modules for all Xradia Versa 3D X-ray microscope systems.
Micro.Spector from Mabri.Vision scans the surface of components over the entire area with a resolution of less than 1µm and detects defects in microstructures – for example, shape deviations, imperfections or particles.
With an optimized field of view, Third Dimension’s T15 sensor is ideal for quality control at automotive manufacturers and suppliers.
Together with MTU Maintenance, Fraunhofer IOF has developed a portable photogrammetry sensor (weight 1.3kg) that enables flexible 3D acquisition, e.g.
The Ametek Spot MM (MeltMaster) application pyrometer provides a single-sensor solution for liquid metal temperature measurements in foundry and tapping applications.