In the combination of resolution and speed, the 3D sensors of the C6-3070 series by AT Automation Technology impress with the new WARP technology (Widely Advanced Rapid Profiling).
The 127.7MP HB-127-S camera is the latest addition to the Bolt 25GigE camera series of Emergent Vision.
The AI-controlled Leo 3D scanner is a wireless and fully self-contained device by Artec that integrates an Nvidia Jetson TX2 processor, a 5-inch HD display and a battery.
At Formnext, IBS Quality, together with Verisurf Software, Aesub and Eleven Dynamics, will present the complete 3D scanning process chain with the PAM system, a mobile scanning and inspection solution complemented by an intelligent software concept.
B&R is adding Deep Learning capabilities to its smart camera portfolio thanks to a collaboration with MVTec and AI processor specialist Hailo.
Anyline’s Tire Tread Scanner works by simply pointing the camera of a smartphone or any standard mobile device at the tire tread to be measured.
Matrix Vision’s BVS 3D-RV1 3D camera, with its 12MP sensors, achieves a level of capture accuracy that is especially necessary for handling small and complex parts in a wider field of view.
The C6040 ultra-compact IPC by Beckhoff has integrated 12th generation Intel Core processors with up to 16 cores.
Building on the Zynq UltraScale+ MPSoCs and Artix UltraScale+ FPGAs, AMD Xilinx adds two new devices to the UltraScale+ family.
Allied Vision integrates the Sony IMX global shutter sensors of the 1st Pregius generation into its Alvium cameras.
Ultron is a Nvidia Jetson-powered Sensor Fusion System of Smartcow that brings high computing power to the edge for applications.
Efinix released the TinyML platform for AI acceleration on its range of FPGAs.
Teledyne Dalsa’s Genie Nano-10GigE M/C8200 and M/C6200 cameras are based on Teledyne e2v’s 67M and 37M monochrome and color sensors and consist of four models with 37 and 67MP resolution.
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.
