Pleora Technologies and perClass BV announce a technology partnership that simplifies the deployment of machine learning hyperspectral imaging for inspection applications.
2019 was Verisurf Software’s best year ever. Because of the significant business expansion in EMEA, changes in sales and support team was neccessary.
For the first time, the EMVA will be active contributor and participate at the European Robotics Forum, taking place Marsch 3 to 5, in Malaga, Spain.
Renishaw announces the appointment of Denis Zayia to the position of President of its U.S.
Naio Technologies closed a €14m Series A funding round.
The new Sheet 1.1 of the VDI/VDE/DGQ/DKD2618 series of guidelines describes procedures for monitoring and testing measuring equipment for geometric quantities.
Since the beginning of the new year, Scanware has been represented in Switzerland by Trimaco, a supplier of packaging machines, labellers and inspection equipment for the pharmaceutical, cosmetics and food industries, as a distributor.
The 16th International Conference on Industrial Dimensional Metrology (Metromeet), which takes place from March 3 to 5 in Bilbao, Spain, has revealed their conference program.
Vision Ventures monitors the performance of listed Vision companies.
To better reflect their new scope with the full range of edge AI technology and applications, including the traditional domain of computer vision and visual AI, the Embedded Vision Alliance changes it’s name to Edge AI and Vision Alliance.
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.
