Building on the Zynq UltraScale+ MPSoCs and Artix UltraScale+ FPGAs, AMD Xilinx adds two new devices to the UltraScale+ family.
Image: Xilinx Inc.
Image: Xilinx Inc.
New Devices to the UltraScale+ Family
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Sensorik und Messtechnik
Image: SmartCow AI Technologies Limited
Image: SmartCow AI Technologies Limited
Multi-Modal Sensor Fusion System
Ultron is a Nvidia Jetson-powered Sensor Fusion System of Smartcow that brings high computing power to the edge for applications.
Image: Efinix, Inc.
Image: Efinix, Inc.
AI Acceleration on FPGAs
Efinix released the TinyML platform for AI acceleration on its range of FPGAs.
Image: Micro-Epsilon Messtechnik GmbH & Co. KG
Image: Micro-Epsilon Messtechnik GmbH & Co. KG
IPC for Automated 3D Evaluation
All 3D sensors of the Micro-Epsilon product portfolio can be connected to the Industrial Performance Unit (IPU) and automatically evaluated.
Image: Matrix Vision GmbH
Image: Matrix Vision GmbH
Embedded Vision Evaluation Kit
The mvBlueNaos evaluation kit by Matrix Vision is a complete package with all necessary components for the realization of sophisticated embedded vision applications.
Image: Ioss GmbH
Image: Ioss GmbH
AI-based Code Reader
The intelligent code readers DMR410/420 with automatic adaptation of the reading strategy by Ioss enable a high level of process reliability.
Image: Spectra GmbH & Co. KG
Image: Spectra GmbH & Co. KG
Embedded Board with UHD High Performance Graphics
The 3.5″ embedded board LE-37P7 has an integrated Intel Core i7-11850H processor (Tiger Lake).
Image: Cincoze Co., Ltd.
Image: Cincoze Co., Ltd.
Embedded PC with High GPU power
The embedded computer DS-1202 by Cincoze provides high CPU performance to handle machine vision and AI computing tasks.
Image: SensoPart Industriesensorik GmbH
Image: SensoPart Industriesensorik GmbH
Detection Results for Arithmetic Operations
The ‘Result Processing’ detector on Sensopart’s Vision Sensor Visor allows – thanks to a software update – links to results from previous executions or other jobs.
Image: TeDo Verlag GmbH
Image: TeDo Verlag GmbH
Embedded Vision Development Kit
Basler showed a self-developed embedded vision processing board at embedded world #ew22.
Image: e-con Systems India Pvt Ltd
Image: e-con Systems India Pvt Ltd
Multi-Camera Solution for Nvidia Jetson AGX Orin
The 4K ultra-low-light camera e-Cam82_Cuoagx by e-con Systems is powered by the Nvidia Jetson AGX Orin SOM and based on the Sony Starvis IMX485 sensor.
Image: Phytec Messtechnik GmbH
Image: Phytec Messtechnik GmbH
ISP Calibration Service for i.MX 8M Plus
The VM-016/17/116/117 board-level cameras are already pre-calibrated with the phyCore i.MX 8M plus module, i.e.
Image: Framos GmbH
Image: Framos GmbH
Camera Accessories for Robotic Starter Kit
Framos has launched the FSM-IMX547, a new camera accessory for the recently introduced Kria KR260 Robotics Starter Kit from AMD Xilinx.
Image: Arrow Central Europe GmbH
Image: Arrow Central Europe GmbH
AI Inferencing on-the-Edge
Qualcomm Technologies and eInfochips are unveiling an AI inferencing-at-the-edge solution consisting of a camera, edge computing for facial recognition, and Amazon Kinesis Video Streams (KVS) for live streaming and notifications.
Image: TQ-Systems GmbH
Image: TQ-Systems GmbH
AI Vision Kit Based on Smarc 2.1
TQ-Embedded presents the MB-Smarc-100100-1 starter kit. Dimensioned at 100x100mm, the Smarc 2.1 carrier board has a practical form factor.
Bild: Avnet EMG GmbH
Bild: Avnet EMG GmbH
i.MX 93 Processors for Smarc Modules
Avnet Embedded will support NXP Semiconductors’ new i.MX 93 application processor family on the Smarc 2.1.1 form factor.
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Image: AT - Automation Technology
Image: AT - Automation Technology
10x Faster 3D Scans
In the combination of resolution and speed, the 3D sensors of the C6-3070 series by AT Automation Technology impress with the new WARP technology (Widely Advanced Rapid Profiling).
Image: Emergent Vision Technologies Inc.
Image: Emergent Vision Technologies Inc.
127.7MP Camera with 19.9FPS
The 127.7MP HB-127-S camera is the latest addition to the Bolt 25GigE camera series of Emergent Vision.
Image: TeDo Verlag GmbH
Image: TeDo Verlag GmbH
Wireless and AI-driven 3D scanner
The AI-controlled Leo 3D scanner is a wireless and fully self-contained device by Artec that integrates an Nvidia Jetson TX2 processor, a 5-inch HD display and a battery.
Image: TeDo Verlag GmbH
Image: TeDo Verlag GmbH
Automatically Spraying and Scanning
At Formnext, IBS Quality, together with Verisurf Software, Aesub and Eleven Dynamics, will present the complete 3D scanning process chain with the PAM system, a mobile scanning and inspection solution complemented by an intelligent software concept.
Bild: TeDo Verlag GmbH
Bild: TeDo Verlag GmbH
Smart Camera with DeepOCR
B&R is adding Deep Learning capabilities to its smart camera portfolio thanks to a collaboration with MVTec and AI processor specialist Hailo.
Image: Anyline GmbH
Image: Anyline GmbH
Tire Tread Scanner
Anyline’s Tire Tread Scanner works by simply pointing the camera of a smartphone or any standard mobile device at the tire tread to be measured.
Image: Matrix Vision GmbH
Image: Matrix Vision GmbH
High Resolution 12MP Stereo Camera
Matrix Vision’s BVS 3D-RV1 3D camera, with its 12MP sensors, achieves a level of capture accuracy that is especially necessary for handling small and complex parts in a wider field of view.
Image: Beckhoff Automation GmbH & Co. KG
Image: Beckhoff Automation GmbH & Co. KG
Ultra-Compact IPC
The C6040 ultra-compact IPC by Beckhoff has integrated 12th generation Intel Core processors with up to 16 cores.
Image: Allied Vision Technologies GmbH
Image: Allied Vision Technologies GmbH
Extended Nvidia Jetson Support
Allied Vision integrates the Sony IMX global shutter sensors of the 1st Pregius generation into its Alvium cameras.
Image: Teledyne Dalsa Inc.
Image: Teledyne Dalsa Inc.
10GigE Cameras with 37 and 67MP
Teledyne Dalsa’s Genie Nano-10GigE M/C8200 and M/C6200 cameras are based on Teledyne e2v’s 67M and 37M monochrome and color sensors and consist of four models with 37 and 67MP resolution.
Image: Schäfter + Kirchhoff GmbH
Image: Schäfter + Kirchhoff GmbH
Vial Scanner
The Vial Scanner by Schäfter+Kirchhoff (www.sukhamburg.com) was developped for the in-situ imaging of Drosophila pupae and for automated measurement of their size.
Image: AutoVimation GmbH
Image: AutoVimation GmbH
Enclosures for Hyperspectral Cameras
Autovimation now offers two new enclosure variants for the FX10 and FX17 hyperspectral imaging cameras from Specim: In addition to the IP 66/67 enclosures previously supplied, a stainless steel version (V4A stainless steel) in hygienic design and a climate-controlled version are now also available.