Framos has launched the FSM-IMX547, a new camera accessory for the recently introduced Kria KR260 Robotics Starter Kit from AMD Xilinx.

Framos has launched the FSM-IMX547, a new camera accessory for the recently introduced Kria KR260 Robotics Starter Kit from AMD Xilinx.
Qualcomm Technologies and eInfochips are unveiling an AI inferencing-at-the-edge solution consisting of a camera, edge computing for facial recognition, and Amazon Kinesis Video Streams (KVS) for live streaming and notifications.
TQ-Embedded presents the MB-Smarc-100100-1 starter kit. Dimensioned at 100x100mm, the Smarc 2.1 carrier board has a practical form factor.
Avnet Embedded will support NXP Semiconductors’ new i.MX 93 application processor family on the Smarc 2.1.1 form factor.
Vecow ESOM-MT-1200 is built with the new MediaTek Genio platform, enabling customers to deploy AIoT applications at the Edge.
In order to distribute packages from a conveyor belt evenly to downstream stations, it is necessary to record the conveyor belt occupancy.
Datasensing’s TL46 high-resolution contrast and luminescence sensor has a white, red or RGB emission source and enables scanning distances of 6 to 12mm (80mm with appropriate lens) at switching frequencies up to 50kHz.
GuacamoleID of Hummingbird AI ist the first Continuous Video-based Verification platform (CVIV), to make sure that there is always the right person behind any device.
A scalable development platform for robotic systems, AMD’s Kria KR260 Robotics Starter Kit provides a smooth path to production deployment with the already available Kria K26 adaptive SOMs. With native ROS 2 support, the standard framework for robotics application development, and pre-configured interfaces for robotics and industrial solutions, the SOM Starter Kit enables the development of hardware-accelerated applications for robotics and machine vision.
Framos brings Analog Devices’ new GMSL3 technology to embedded vision.
The PS-30 profile sensor by Di-Soric is ready for use in just a few steps.
Adlink and AWS have developed an Edge AI Vision Development Starter Kit for automated defect detection in manufacturing.
Teledyne Flir’s X858x and X698x highspeed thermal imaging cameras enable high-resolution thermal imaging for MWIR and LWIR R&D.
The new variants of the OX200 profile sensors by Baumer offer high precision with resolutions down to 5µm in a compact housing due to their blue laser beam.
The thicknessGauge O.EC by Micro Epsilon is an inline measuring system in O-frame design with an aluminum roller and an integrated control cabinet.
The COM-HPC Server Carrier Board MSC HS-MB-EV by Avnet Embedded allows access to the new COM-HPC server technology and supports initial lab evaluations, rapid prototyping and early application development.
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Partnering with Nikon and having integrated their technology, the handheld 3D scanner M-Scan 120 of Metronor combines Nikon’s experience in scanning and Metronor’s knowledge in tracking and navigation.
The new version of Artec Studio 17 (AS17) 3D scanning software enables advanced functionality for quality inspection, reverse engineering and full-color CGI workflows.
Inspekto introduces a new software version for the S70 autonomous vision system.
The µEye XC camera with autofocus by IDS is as easy to use as a webcam.
Centerpiece of the EoSens21CXP2 camera by Mikrotron is Gpixel’s 21MP Gsprint 4521 CMOS sensor with global shutter.
Cincoze’s GM-1000 and GP-3000 series of embedded GPU computers use very powerful Intel Xeon and Core processors.
Perclass and Unispectral provide the Monarch II mobile Multispectral Camera with the perClass Mira control and analytical software.
Nikon Metrology’s APDIS gap and flush measurement system can perform measurements at belt speeds of up to 140mm/s, has a large measurement volume, and uses up to three laser radar sensors for measurements around the entire vehicle.
A new inline process by Vitronic enables quality testing of lithium-ion batteries for electric vehicles.
The new Scan liquid by Attblime was developed for the precise matting of very small reflective or transparent parts.
Version 2022 of the Calypso measuring software by Zeiss IMT increases performance in data acquisition as well as in the evaluation of results.
The DLS modules by vialux are designed for digital imaging applications that require DLP pattern projection combined with synchronized image acquisition.
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