Teledyne e2v’s Topaz5D full HD CMOS image sensor combines 2D vision with 3D depth information.
Teledyne e2v’s Topaz5D full HD CMOS image sensor combines 2D vision with 3D depth information.
An optical free-fall inspection system from Fraunhofer IPM checks cold-formed components for geometric dimensional accuracy and surface quality with accuracies in the range of a few hundredths of a millimeter.
Hacarus will unveil a new multi-camera imaging feature for its AI visual inspection solution.
Teledyne Imaging has announced a concept for embedded vision called Integrated Vision Solutions (IVS).
The SmartGatePlus from AIT Goehner is based on the SmartGate introduced last year, which enables 1D/2D code reading of pallets on-the-fly or at a standstill.
Tichawa Vision has developed a Contact Image Sensor (CIS) especially for wafer inspection.
With the Foreign Object Detection System (FOS), Sick presents a system solution for minimizing process errors in the assembly of high-voltage batteries.
Vieworks introduces the auto focus tracking system VEO Focus.
Kitov.ai introduces the K-Box, a cost-effective machine vision systems that combine AI, 3D imaging, and intelligent robotic planning technologies.
To determine a safe absolute position, Pepperl+Fuchs offers a combination of the PUS evaluation unit with the safePXV or WCS sensors.
Chromasens has introduced a new mechanical adapter that allows precise, fast alignment of Chromasens AllPixa line scan cameras using the company’s GenICam Control Tool 2.4 (GCT) software.
In the CAMWear 2.0 project, a research team from the Fraunhofer IPT, together with project partners, has now developed a system that precisely records and evaluates the wear condition of cutting tools almost in real time during the milling process.
The Keyence VS model series enables quick problem solving for a variety of testing applications thanks to smart hardware architecture.
Anyline’s tire tread scanner scans the tire tread using the camera of any mobile device (smartphone, tablet, etc.) and creates an exact, digital tire model based on the measurements.
VisionTools offers systems for visual inspection, identification and robot control.
With the S70 Mobile, Inspekto now offers the proven AMV-AI technology with even more flexibility.
Sony recently released a 247MP rolling shutter CMOS image sensor available in monochrome (IMX811-AAMR) and color (IMX811-AAQR) variants which have a 64.84mm diagonal, a square pixel array, as well as 5.3fps.
The NXT malibu camera from IDS enables AI-based image processing, video compression and streaming in full 4K sensor resolution at 30fps – directly in and out of the camera.
BitFlow has integrated the Nvidia Jetson AGX Orin module with its CoaXPress (CXP) frame grabbers.
The Terascope from the Helmut Fischer Group enables the layer thickness measurement of organic single and multiple layers on any base material with terahertz.
The Computer Vision Toolbox in the 2024a (R2024a) release of the Matlab and Simulink product families from MathWorks provides algorithms, functions and apps for the design and testing of computer vision, 3D vision and video editing systems.
Emergent Vision introduces the expanded real-time 3D/4D reconstruction capabilities within the companie’s eCapture Pro software.
Alkeria’s latest addition to its Celera P camera series, a polarization camera to use dual-USB3 technology, features the 12MP Sony Pregius IMX 253 sensor.
Cognex Corporation’s In-Sight L38 3D Vision System combines AI, 2D, and 3D vision technologies to solve a range of inspection and measurement applications.
The 10GigE camera MV-CH1510-10FM from Hikrobot (distributor Maxxvision) uses Sony’s IMX411 rolling shutter CMOS to transmit images with a resolution of 151MP and 6.2fps.
Teledyne Flir IIS announced SightBase – a Software-as-a-Service (SaaS) platform – that accelerates the design-in cycles for imaging systems.
Starting with a variant that connects to Zebra’s Iris GTX Smart Cameras, Advanced Illumination has developed the LED lighting controller Light Hub.
Aesub offers the Aesub Infinity endless points for 3D scanning of very large components that are quickly placed on large surfaces from the roll.