News
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Count Smart
The new AI-based counting tool from Cognex’s In-Sight SnAPP series simplifies the way counting tasks can be accomplished.
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USB Cards for Multi-Camera Setups
Basler introduces USB interface cards which are designed for seamless integration into vision systems and robust performance in industrial environments.
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Fiber Mini SFF for GigE Vision
OptoMedia’s ultra-compact Mini SFF brings reliable, high-speed fiber connectivity to next-generation industrial cameras.
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High-Resolution High-Speed CIS in Color
The high-resolution high-speed AxCIS line scan camera modules from Teledyne Dalsa are now also available in color.
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Computer Laminography for Testing Large Components
The Clara computer laminography system from Fraunhofer EZRT can be used to examine very large, flat objects, e.g.
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High Resolution Sensors with wide Angel of View
Sony Semicon’s IMX901 and IMX902 global shutter image sensors can achieve high-resolution imaging with approximately 16.41/12.38 effective megapixels, respectively, thanks to their 2.74µm miniature pixel and horizontal-only 8K/6K high pixel…
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Plug&Play 3D Laser Snapshot Sensor
Keyence presents the 3D laser snapshot sensor LJ-S8000 for 3D inline inspections.
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Ultra-Compact 3D Camera
With Ensenso B, IDS is launching an ultra-compact 3D camera that works at close range and with a large field of view.
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Calypso Version 2024 for Dimensional Metrology
The 2024 version of the Zeiss metrology software Calypso comprehensively evaluates the data obtained from tactile and optical measurements from the Zeiss KMM.
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Development Kit with TI AM68x and TDA4x
Phytec´s phyBoard-Izar Rapid development kit is a single board computer with the new TI AM68x and TDA4x.
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Extremely Compact Embedded PCs for AI
Plug-In Electronic presents the SPC-9000 series from Vecow, three embedded box PCs that integrate the latest Intel Core Ultra processors and comprehensive interfaces in a small 15x10cm housing.
















