Matrix Vision’s BVS 3D-RV1 3D camera, with its 12MP sensors, achieves a level of capture accuracy that is especially necessary for handling small and complex parts in a wider field of view. An integrated pattern projector optimizes the capture of difficult parts or scenes with low visual texture. Image data for depth image calculation is transferred in parallel via two GigE interfaces, achieving repetition rates of up to 9Hz, depending on resolution and GPU processing power. The included SGM Producer software library ensures GigE Vision and GenICam compatibility and thus the connection to own applications or third-party 3D software.
For bow, warp, TTV and quality inspection of semiconductor wafers in shorter cycle times Precitec has launched the ultra-fast Flying Spot Scanner (FSS) 310. Its features include flexible scan trajectories, the ability to measure 12″ wafers and a Z resolution in the nm range.