3D-Bildverarbeitung (3DB)
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Bild: VoxelSensorsIntelligent Active Event Sensing
VoxelSensors presents the LyraCam P, its latest advancements to its patented Spaes (Single Photon Active Event Sensor) technology and an intelligent dynamic triangulation system (Resolution 300×150) for XR and robotics.
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Image: Lidwave Ltd.4D On-Chip Sensing
Lidwave’s patented Finite Coherent Ranging (FCR) technology reshapes automation, delivering unparalleled on-chip precision for advanced machine vision.
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Image: OptoMedia TechnologyFiber Mini SFF for GigE Vision
OptoMedia’s ultra-compact Mini SFF brings reliable, high-speed fiber connectivity to next-generation industrial cameras.
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Image: AT Sensors3D Sensor with 7.8µm X-axis Resolution
AT Sensors introduces the C7 XCS 3070 3D laser profile sensor which boasts an X-axis resolution of 7.8µm within a 24mm field of view, enabling it to capture even the…
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Image: Stemmer Imaging AG / TeDo VerlagNew Stemmer CEO
Mike Weccardt is the new CEO of Stemmer Imaging. He succeeds Paul Scholten, who took over as interim CEO almost six months ago.
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Image: Micro-Epsilon Messtechnik GmbH & Co. KGHigh-End Laser Sensor with 150kHz
The OptoNCDT 5500 laser triangulation sensor from Micro Epsilon now achieves a measurement rate of up to 150kHz across its entire measuring range, making it one of the fastest laser…
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Image: RealSense Inc.Depth Cameras with GMSL
RealSense announced expanded support for GMSL across its depth camera portfolio, delivering a scalable, production-ready perception platform for robotics and industrial automation.
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Bild: Teledyne DALSA2D and 3D AI Camera with just one CMOS
Teledyne e2v introduces the Perciva 5D camera, which generates 2D and 3D data from a single CMOS sensor.
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Image: Espros Photonics CorporationToF Starter Kit with Raspberry Pi 5
Espros Photonics introduces the EPC670 Starter Kit, a ready-to-use 3D depth evaluation platform built around the EPC670 ToF sensor and a Raspberry Pi 5 host system.
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Bild: Sony Europe B.V.3D-Array-Lidar with SPAD-Technology
Sony Europe Digital Imaging Business introduced the AS-DT1, a 3D array sensing lidar with SPAD technology, all-in-one product.
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Image: IDS Imaging Development Systems GmbH1.2MP ToF Camera for Dynamic Environments
The Nion time-of-flight camera from IDS combines high spatial resolution – thanks to the 1.2MP AF0130 sensor from onsemi’s Hyperlux ID family – with reliable depth accuracy, delivering detailed 3D…
