Wafer thickness distribution in 5sec

hamamatsu
Image: Hamamatsu Photonics Europe GmbH

Hamamatsu’s HyperGauge Thickness measurement system C17319-11 employs a spectroscopic interference method for precise film thickness measurement. Equipped with the -Capture technology, which detects wavelength shifts using high-sensitivity cameras without a spectrometer, it can measure the entire film thickness of up to 300mm wafers in as little as five seconds.