The ReflectControl RCS3500-300 from Micro-Epsilon captures the entire surface of wafers with diameters of up to 300mm in a single acquisition. This full-field 3D deflectometry enables the precise measurement of warpage, bow, and local wafer deformations, with acquisition times starting from one second. If defined limit values are exceeded, the control system can respond via I/O signals to eject deformed wafers before they undergo further processing. This ensures the reliability of subsequent process steps.
