AT Automation Technology has integrated MultiPeak, a new feature in the Cx4090HS 3D sensor module, which for the first time enables interference-free recording of 3D profile data via laser triangulation.
The DCAM560C series by Vzense Tech is an industrial RGB-D camera based on ToF technology.
OQmented’s ultra-compact 3D depth sensing camera provides a cost-effective solution for upgrading mobile or stationary cameras with complimentary RGB-D technology.
Amazon Lookout for Vision supports anomaly detection at the edge now.
Avnet Embedded expands its COM express product portfolio in the upper performance sector with the COM express Type 6 module family MSC C6B-ALP.
Innodisk’s EGPL-T101 is an M.2 2280-to-single 10GbE Base-T Ethernet module.
Kaya Instruments presents CoaXPress Over Fiber (CoF) Cameras, Frame Grabbers, and FPGA IP.
Sony Semicon has developed a stacked CMOS image sensor technology with 2-Layer Transistor Pixel.
Teledyne Flir’s bundle of Oryx 10GigE camera and Myricom card is designed for 10GigE applications.
Photonfocus’ MV4-D2048-L01-3D06-GT photon 3D camera for laser triangulation is equipped with the Luxima LUX2810 sensor, which offers a scan rate of up to 100kHz.
Researchers at Princeton University and the University of Washington have developed an ultracompact camera the size of a coarse grain of salt.
The 604MP CoaXPress area scan camera MV-CH6040-10XM from Hikrobot adopts the Sony IMX 411 rolling shutter CMOS and a built-in pixel-by-pixel correction algorithm to provide images in high dynamic range and low noise.
SVS-Vistek has with the Shr661 an industrial camera with 127MP and global shutter in program.
The Alvium 1800 camera series from Allied Vision is now also available with Sony’s InGaAs SWIR sensors.
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.
