Partnering with Nikon and having integrated their technology, the handheld 3D scanner M-Scan 120 of Metronor combines Nikon’s experience in scanning and Metronor’s knowledge in tracking and navigation.
Framos has launched the FSM-IMX547, a new camera accessory for the recently introduced Kria KR260 Robotics Starter Kit from AMD Xilinx.
The new version of Artec Studio 17 (AS17) 3D scanning software enables advanced functionality for quality inspection, reverse engineering and full-color CGI workflows.
Qualcomm Technologies and eInfochips are unveiling an AI inferencing-at-the-edge solution consisting of a camera, edge computing for facial recognition, and Amazon Kinesis Video Streams (KVS) for live streaming and notifications.
Inspekto introduces a new software version for the S70 autonomous vision system.
The µEye XC camera with autofocus by IDS is as easy to use as a webcam.
Centerpiece of the EoSens21CXP2 camera by Mikrotron is Gpixel’s 21MP Gsprint 4521 CMOS sensor with global shutter.
Cincoze’s GM-1000 and GP-3000 series of embedded GPU computers use very powerful Intel Xeon and Core processors.
TQ-Embedded presents the MB-Smarc-100100-1 starter kit. Dimensioned at 100x100mm, the Smarc 2.1 carrier board has a practical form factor.
Perclass and Unispectral provide the Monarch II mobile Multispectral Camera with the perClass Mira control and analytical software.
Nikon Metrology’s APDIS gap and flush measurement system can perform measurements at belt speeds of up to 140mm/s, has a large measurement volume, and uses up to three laser radar sensors for measurements around the entire vehicle.
A new inline process by Vitronic enables quality testing of lithium-ion batteries for electric vehicles.
Avnet Embedded will support NXP Semiconductors’ new i.MX 93 application processor family on the Smarc 2.1.1 form factor.
Vecow ESOM-MT-1200 is built with the new MediaTek Genio platform, enabling customers to deploy AIoT applications at the Edge.
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.
