Chromasens has introduced a 3D inspection system designed for detecting imperfections on the surface of metal cylinder heads requiring large field of views.
Bicker Elektronik offers coordinated Power+Board bundles consisting of power supply, mainboard and accessories.
The 4200C Hyperspectral Camera by Hinalea Imaging has 300 spectral bands and a spectral resolution of 4nm (FWHM).
Verisurf Software announces the release of its new software version 2023.
Analog Devices announced a high-resolution Time-of-Flight (iToF) module for 3D depth sensing and vision systems.
The 3.5″ embedded board LE-37P7 has an integrated Intel Core i7-11850H processor (Tiger Lake).
Princeton’s Computational Imaging Lab has released a paper about ‘Self-Supervised Depth Estimation from Gated Images’, a new method for generating highly detailed depth maps from a gated camera.
The embedded computer DS-1202 by Cincoze provides high CPU performance to handle machine vision and AI computing tasks.
The ‘Result Processing’ detector on Sensopart’s Vision Sensor Visor allows – thanks to a software update – links to results from previous executions or other jobs.
The MY23F 2.3mm lens by Theia provides a 116° horizontal field of view on a 1/1.8″ sensor without the fisheye or barrel distortion of typical wide-angle lenses.
The USB 3.2 Gen1 waterproof cable by Comoss was designed for application in harsh industrial environments.
Itala G is a series of GigE Vision industrial PoE cameras with resolutions ranging from 3.2 to 31MP.
The i-Speed 2 highspeed camera series by iX Cameras consists of four models based on different resolution needs (1 to 2.6MP), speed requirements (up to 2.77GPx/sec) and record durations (up to 16GB internal RAM).
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.
