The Helios2+ is an advanced version of the Helios2 ToF camera offering two new key features: High Dynamic Range and High-Speed Time-of-Flight mode, enabling deployment in challenging environments. Helios2+ offers a ‘factory tough’ IP67-rated enclosure and provides excellent 3D depth data with sub-mm precision.
Chromasens has introduced a 3D inspection system designed for detecting imperfections on the surface of metal cylinder heads requiring large field of views.
Bicker Elektronik offers coordinated Power+Board bundles consisting of power supply, mainboard and accessories.
The 4200C Hyperspectral Camera by Hinalea Imaging has 300 spectral bands and a spectral resolution of 4nm (FWHM).
Verisurf Software announces the release of its new software version 2023.
Analog Devices announced a high-resolution Time-of-Flight (iToF) module for 3D depth sensing and vision systems.
The 3.5″ embedded board LE-37P7 has an integrated Intel Core i7-11850H processor (Tiger Lake).
Princeton’s Computational Imaging Lab has released a paper about ‘Self-Supervised Depth Estimation from Gated Images’, a new method for generating highly detailed depth maps from a gated camera.
The embedded computer DS-1202 by Cincoze provides high CPU performance to handle machine vision and AI computing tasks.
The ‘Result Processing’ detector on Sensopart’s Vision Sensor Visor allows – thanks to a software update – links to results from previous executions or other jobs.
The MY23F 2.3mm lens by Theia provides a 116° horizontal field of view on a 1/1.8″ sensor without the fisheye or barrel distortion of typical wide-angle lenses.
Itala G is a series of GigE Vision industrial PoE cameras with resolutions ranging from 3.2 to 31MP.
The i-Speed 2 highspeed camera series by iX Cameras consists of four models based on different resolution needs (1 to 2.6MP), speed requirements (up to 2.77GPx/sec) and record durations (up to 16GB internal RAM).