3D-Bildverarbeitung (3DB)
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Image: Sony SemiconductoriToF Pixel Sensors
At the IEDM 2024 semiconductor trade fair, Sony Semicon presented a combination sensor in which the camera sensor is located directly above the depth sensor / Time-of-Flight sensor.
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Image: PropheseeStructured Light Embedded System with 500Hz
Prophesee Metavision EVK3D is a very fast structured light embedded system.
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Image: TeDo Verlag GmbHSmart 3D ToF Camera
At the SPS, Contrinex presented a smart 3D camera that will be released in Q2/25.
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Image: TeDo Verlag GmbHTime-of-Flight Sensors with Display
The latest generation of time-of-flight laser sensors from wenglor enables easy configuration thanks to the OLED display and shows the distance value (max.
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Image: Sick AG3D Completeness Control for Logistics
Der MIDS (Missing Item Detection Sensor) von Sick erkennt fehlende Artikel in Gebinden wie Kartons, Kisten oder Paletten.
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Image: TeDo Verlag GmbHToF Camera and Event-Based Vision with USB3
IDS presented the uEye XCP with the event-based sensor IMX636 from Sony and Prophesee at Vision.
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Image: Fraunhofer-Institut IOFHigh-Speed 3D Sensor for Crash Tests
The Fraunhofer IOF’s high-speed 3D sensor goCrash3D records 3D data during crash tests in the test vehicle.
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IMage: Scape Technologies LtdDifferent 3D Scanner Variants
Scape Technologies is introducing various new 3D scanners: the Ultra and Pro Industrial 3D stationary scanner series and the robot-guided 3D scanner Mini.
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Image: AT – Automation TechnologyAffordable 3D Sensors with a Large FoV
Double pixel resolution, more field of view variants, extensive software features: AT – Automation Technology is expanding its cost-effective ECS series with the 3D sensor ECS 4090, which was specially…
