Silina has developed a new technology that allows hundreds of image sensors to be curved simultaneously. The curving process is always the same, regardless of format and technology, especially for CMOS and CCD. It can be applied to FSI and BSI sensors, as well as to different spectral bandwidths (UV to visible to IR). The process enables low-volume manufacturing with the curvature of a single sensor as well as mass production. In addition, various designs are possible: spherical, aspherical, freeform, or customized shapes upon request. The manufacturing process is also designed to maintain the same original packaging for classic flat sensors.
In the combination of resolution and speed, the 3D sensors of the C6-3070 series by AT Automation Technology impress with the new WARP technology (Widely Advanced Rapid Profiling).