Aries Embedded offers the URP UAV (Unmanned Aerial Vehicle) and robotics platform from Topic Embedded Systems in D/A/CH. The highly integrated single board design is based on the Xilinx Zynq UltraScale+ MPSoC and combines the Xilinx SoC FPGA with common standard components and interfaces on a small form factor. The platform consists of a processor board with integrated sensors, a Linux-based software stack, an FPGA reference design and optional expansion modules, e.g. for 4k cameras or stepper motors. Additional functionalities, such as ultrasonic and radar/lidar sensors, can be added. Due to the large number of available interfaces and signals, the board can easily be expanded with additional functions. Thus, software defined radio, on-chip 4K video stream acquisition and manipulation, H264/265 compression, and other functions are readily achievable. The board supports the ZU4/5/7 variants of the Zynq Ultrascale+ family of Xilinx SoCs on a 135×68.4x10mm footprint.
3D Surface Inspection of Cylinder Heads
Chromasens has introduced a 3D inspection system designed for detecting imperfections on the surface of metal cylinder heads requiring large field of views.