With the X-ray inspection system CA20 and highly developed computer laminography and AI, Comet Yxlon enables the use of the potential of high-resolution 3D X-ray technology for the detailed inspection of integrated circuits in advanced packaging. 3D X-ray images with a resolution of less than 1m can reliably identify typical errors in 3D IC solder connections such as missing and bridged bumps, voids, non-wet, head-in-pillow, bump shift and deviations in standoff height or deformations. Analysis software based on deep learning carries out the automatic evaluation including reporting according to the user’s requirements.
MIPI Cameras with GMSL2 for up to 10m Cable Length
Vision Components now offers its MIPI cameras with a GMSL2 interface for data transmission with cables up to 10 meters long.