MV Forum at Sony Stuttgart with 150 participants
Almost 150 participants attended the 73rd Heidelberg Image Processing Forum, which this time took place at Sony in Stuttgart and focused on image sensor technology. Among others, Prof. Dr. Theuwissen presented the possibilities for CMOS through Deep Trench Isolation, Sony presented future polarization chips with pixel sizes of 2.5µm, Prof. Jähne presented new runtime sensors and Basler presented an approach for fractional binning.
Image: TeDo Verlag GmbH
On March 3, 2020, the next forum will take place at Dentsply Sirona in Bensheim.
