Autovimation now offers two new enclosure variants for the FX10 and FX17 hyperspectral imaging cameras from Specim: In addition to the IP 66/67 enclosures previously supplied, a stainless steel version (V4A stainless steel) in hygienic design and a climate-controlled version are now also available. The camera temperature is cooled up to 25K below ambient temperature.
BitFlow has integrated the Nvidia Jetson AGX Orin module with its CoaXPress (CXP) frame grabbers.
The Terascope from the Helmut Fischer Group enables the layer thickness measurement of organic single and multiple layers on any base material with terahertz.
The Computer Vision Toolbox in the 2024a (R2024a) release of the Matlab and Simulink product families from MathWorks provides algorithms, functions and apps for the design and testing of computer vision, 3D vision and video editing systems.
Emergent Vision introduces the expanded real-time 3D/4D reconstruction capabilities within the companie’s eCapture Pro software.
Alkeria’s latest addition to its Celera P camera series, a polarization camera to use dual-USB3 technology, features the 12MP Sony Pregius IMX 253 sensor.
Cognex Corporation’s In-Sight L38 3D Vision System combines AI, 2D, and 3D vision technologies to solve a range of inspection and measurement applications.
The 10GigE camera MV-CH1510-10FM from Hikrobot (distributor Maxxvision) uses Sony’s IMX411 rolling shutter CMOS to transmit images with a resolution of 151MP and 6.2fps.
Teledyne Flir IIS announced SightBase – a Software-as-a-Service (SaaS) platform – that accelerates the design-in cycles for imaging systems.
Aesub offers the Aesub Infinity endless points for 3D scanning of very large components that are quickly placed on large surfaces from the roll.
Hamamatsu Photonics Europe C16741-40U is an InGaAs camera with sensitivity in the visible to near infrared region from 400 to 1700nm.
OPT presents the one-click measurement sensor SmartFlash at Control fair.
Arrow Electronics’ compact (25.0×70.7mm) CYC5000 FPGA board with Arduino-compatible header simplifies the development of IoT edge devices using programmable logic, RISC-V with Altera’s Nios V, DSP accelerators and hardware -IP blocks.
