High Speed FPGA in a small, low power Footprint

Image: Efinix, Inc.

Efinix´s Ti375 FPGA is manufactured in an advanced 16 nm process node. Titanium FPGAs deliver performance and efficiency through high-density, low power and high compute in small package footprints ranging from 35,000-to-1 million logic elements. Ti375, with a capacity of 375K logic elements features a Quad-Core Hardened RISC-V block at over 1GHz with Linux capable MMU, FPU and custom instruction capability, a Quad SerDes transceivers supporting up to 16 Gbps raw data rates with multiple protocols, including PCIe 4.0, Ethernet SGMII and Ethernet 10GBase-KR protocols, as well as PMA Direct mode and a dual Embedded PCIe Gen4x4 controllers supporting root complex and end point with SRIOV (Single Root I/O Virtualization) and dual hardened LPDDR4/4X DRAM controllers for high bandwidth access to external memory.