Usually, the camera size is limited and hampered by the surface of the largest integrated PCB and its components. Ximea has developed a solution to split the camera into separate parts, isolate the PCBs and connect them with a flat flexible ribbon cable. The super-fast speed 32GBit/s data throughput and the integration of the sensors into a unique, non-conventional type of camera assembly are enabling new solutions in applications that have identified the Sony sensors as imaging workhorse but were inhibited by the form factor or by limited performance of currently available implementations.
3D Sensors with GigE Vision 2.1
With the newest firmware update, all Photoneo 3D cameras running on firmware 1.10 are fully compatible with GigE Vision 2.1.