B&R is adding Deep Learning capabilities to its smart camera portfolio thanks to a collaboration with MVTec and AI processor specialist Hailo. The first product to emerge from the project is Deep OCR and achieves particularly fast read rates, even for fonts that are otherwise difficult to recognize. Despite a performance of 26 TOPS, Hailo’s inference accelerators consume particularly little power, enabling the Deep Learning camera to be used as an edge device.
12″ Wafers Inspection in Single Scan
For bow, warp, TTV and quality inspection of semiconductor wafers in shorter cycle times Precitec has launched the ultra-fast Flying Spot Scanner (FSS) 310. Its features include flexible scan trajectories, the ability to measure 12″ wafers and a Z resolution in the nm range.