Congatec’s new COM Express Compact Computer-on-Modules with AMD Ryzen Embedded 8000 Series processors are based on the cores of the new Ryzen processors with up to eight Zen 4 cores, XDNA NPU and Radeon RDNA 3 graphics. The modules have an AI inference performance of up to 39 TOPS. This makes the conga-TCR8 Type 6 modules particularly attractive for high-volume and price-sensitive applications that place high demands on AI, graphics and computing power in any combination.
Werth EasyScope multi-sensor coordinate measuring machines are now available in three versions.
Lucid Vision launched the Atlas10 SWIR, a 10GigE camera with RDMA support featuring Sony’s 5.2 MP IMX992 and 3.2 MP IMX993 SenSWIR InGaAs sensors with integrated thermoelectric cooling…
Espros Photonics introduces the EPC670 Starter Kit, a ready-to-use 3D depth evaluation platform built around the EPC670 ToF sensor and a Raspberry Pi 5 host system.
Teledyne e2v introduces the Perciva 5D camera, which generates 2D and 3D data from a single CMOS sensor.
Anticipate’s Fluidworks delivers a production-ready, scalable AI-powered evaluation solution – including operator guidance and analytics – for adhesive seam inspection.
