For bow, warp, TTV and quality inspection of semiconductor wafers in shorter cycle times Precitec has launched the ultra-fast Flying Spot Scanner (FSS) 310. Its features include flexible scan trajectories, the ability to measure 12″ wafers and a Z resolution in the nm range. The systems combines OCT with wide FoV scanning and solves the issue of ultra-precise measuring systems normally working very slowly and being extremely expensive. Thanks to its huge scan area of 310mm, the FSS 310 will measure the total thickness variation (TTV), bow and warp of an entire 12-inch wafer and detect any voids in a single scan – and do it in as little as 10 seconds per wafer for standard applications. The FSS 310 is enabling a throughput of over 300 wafers per hour (including handling time). In combination with Precitec’s CHRocodile 2 IT optical sensor, the FSS 310 forms a standalone package that is easily integrated into offline or inline applications.
High-Performance Picking Solution
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.