Basler showed a self-developed embedded vision processing board at embedded world #ew22. It includes various interfaces for image processing and allows the connection of different camera types. The development kit benefits from a SoM and carrier board approach based on NXP’s i.MX 8M Plus SoC and can be used not only for prototyping but also in series production due to its design conceived for industrial use.
Chromasens has introduced a 3D inspection system designed for detecting imperfections on the surface of metal cylinder heads requiring large field of views.
Bicker Elektronik offers coordinated Power+Board bundles consisting of power supply, mainboard and accessories.
The 4200C Hyperspectral Camera by Hinalea Imaging has 300 spectral bands and a spectral resolution of 4nm (FWHM).
Verisurf Software announces the release of its new software version 2023.
Analog Devices announced a high-resolution Time-of-Flight (iToF) module for 3D depth sensing and vision systems.
The 3.5″ embedded board LE-37P7 has an integrated Intel Core i7-11850H processor (Tiger Lake).
Princeton’s Computational Imaging Lab has released a paper about ‘Self-Supervised Depth Estimation from Gated Images’, a new method for generating highly detailed depth maps from a gated camera.
The embedded computer DS-1202 by Cincoze provides high CPU performance to handle machine vision and AI computing tasks.
The ‘Result Processing’ detector on Sensopart’s Vision Sensor Visor allows – thanks to a software update – links to results from previous executions or other jobs.
The MY23F 2.3mm lens by Theia provides a 116° horizontal field of view on a 1/1.8″ sensor without the fisheye or barrel distortion of typical wide-angle lenses.
Itala G is a series of GigE Vision industrial PoE cameras with resolutions ranging from 3.2 to 31MP.
The i-Speed 2 highspeed camera series by iX Cameras consists of four models based on different resolution needs (1 to 2.6MP), speed requirements (up to 2.77GPx/sec) and record durations (up to 16GB internal RAM).