The 4K ultra-low-light camera e-Cam82_Cuoagx by e-con Systems is powered by the Nvidia Jetson AGX Orin SOM and based on the Sony Starvis IMX485 sensor.
VisionCommander – a PC-based image processing software for optical inspection by senswork – supports 2D and 3D cameras as well as scanners from a wide range of manufacturers.
AllRounDia DualVision from Pixargus inspects the contour and surface of hoses, tubes and cables.
Mech-Mind has announced the release of a new version of the Mech-Eye 3D camera at automatica. The UHP-140 model is designed for inspections and measurements with accuracies in the µm range and can also be used on polished, shiny and highly reflective surfaces.
Photoneo presented at the automatica fair the MotionCam-3D Color for colourful 3D point clouds in real-time and with sub-millimter accuracy.
With Amelia, a data generation tool by Aimino, companies need up to 95% less data for AI applications.
The VM-016/17/116/117 board-level cameras are already pre-calibrated with the phyCore i.MX 8M plus module, i.e.
The SWIR linear light GEVXD by Genesi Elettronica is for linear or matrix cameras with SWIR wavelength from 980 to 1650nm.
A dome light, two angles of dark field illumination, and a four-quadrant multispectral ring light are all combined in the patented DoAll Light by Smart Vision Lights.
With the Alvium 1800 U-052 and U-291, Allied Vision integrates two 3rd generation Sony IMX CMOS sensors into its camera series with USB3 Vision interface.
JAI’s Go-X camera series is expanding to include 24 global shutter models with CXP 2.0 or GigE Vision, offering resolutions from 5.1 to 24.5MP.
The new 10GigE camera VC-25M10G-m/C 41 I by Vieworks has a 26MP resolution (5.120×5.120 Pixel) and the Gpixel image sensor GMAX0505 integrated.
The new members of the xiX camera family by Ximea deliver resolutions starting from 61MP up to 151MP, all based on backside illuminated technology from Sony.
Eight new boost camera models with resolutions of up to 12MP were launched by Basler.
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.
