The new Helios2+ camera of Lucid Vision includes two new on-camera depth processing modes compared to the Helios2: High Dynamic Range Mode and High Speed Mode.
Maxim Integrated introduces the Maxrefdes178#, a compact camera cube reference design (41x44x39mm).
For decentralized preprocessing of image data in embedded vision projects with MIPI camera modules, Vision Components has developed an FPGA-based accelerator with multiple MIPI CSI-2 inputs and outputs.
The EasyOCR2 library by Euresys now supports optical character recognition using deep learning technologies, with no need to use a GPU.
Murrelektronik is entering the field of image processing and offers decentralized, directly in the machine environment mountable and pluggable assemblies such as switches, distributors and feeders as well as the corresponding assembled cable and connector technology.
With the O3R hardware platform, ifm presents an edge device to which up to six 3D cameras and numerous other sensors can be connected.
The LD line scan camera lens series by Phenix Optics Co, offers three focal lengths and 100MP image resolution.
Gpixel expands the Gmax product family of global shutter image sensors with the 152MP GMAX32152.
Sony Semiconductor Solutions announced the release of the IMX487, a 2/3-type CMOS image sensor for industrial equipment, which is compatible with the UV (ultraviolet light) wavelength and comes with global shutter functionality and an effective pixel count of approximately 8.13MP.
Chromasens announced the expansion of its allPixa evo line-scan camera family with three new models with a CoaXPress 2.0 interface.
Photonfocus introduces a new SWIR camera for the 900 to 1700nm spectral range based on the company’s photonSpectral platform.
Basler is expanding its product portfolio with additional CXP-12 camera models from the boost series, two multi-channel CXP-12 interface Ccrds, and a variety of matching components.
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.
