The new members of the xiX camera family by Ximea deliver resolutions starting from 61MP up to 151MP, all based on backside illuminated technology from Sony. Enhancing these sensors with the speed of PCIe interface results in 61MP@17fps, 101MP@8fps, 151MP@6fps and more with Binning. For various heat dissipation options, several heatsink modules are developed – the default one is a Fan attached to the back of the camera. To eliminate any vibrations and decrease the heat even further a module with Water (liquid) cooling is being prepared as well.
