By combining high-resolution 3D X-ray and automated 3D metrology for CoS (chip-on-substrate) solder connections, the Comet Yxlon CA20 enables manufacturers to identify and eliminate systematic yield issues faster than ever before. 3D X-ray images with resolutions below 1µm allow to detect critical defects in IC solder connections reliably and automatically, such as bump shift, voids or head-in-pillows, as well as deviations in stand-off height or deformations. The latest revision of the system featuring a fully automated defect recognition and full integration into the production line supporting continuous process monitoring.
