With the X-ray inspection system CA20 and highly developed computer laminography and AI, Comet Yxlon enables the use of the potential of high-resolution 3D X-ray technology for the detailed inspection of integrated circuits in advanced packaging. 3D X-ray images with a resolution of less than 1m can reliably identify typical errors in 3D IC solder connections such as missing and bridged bumps, voids, non-wet, head-in-pillow, bump shift and deviations in standoff height or deformations. Analysis software based on deep learning carries out the automatic evaluation including reporting according to the user’s requirements.
