Silina has developed a new technology that allows hundreds of image sensors to be curved simultaneously.
Silina has developed a new technology that allows hundreds of image sensors to be curved simultaneously.
The new Evaluation Kit (EVK) of Prophesee gives developers early access to the event-based Vision sensor co-developed with Sony Semiconductor Silutions, which features a 4.86mp pitch and 1.280x720pixel resolution.
Renesas’ new RZ/V2L MPUs are designed for entry-level AI applications and include the DRP-AI (Dynamically Reconfigurable Processor) AI accelerator.
Tichawa’s RingCIS (Contact Image Sensor) provides inspection and defect detection for pipes of limited and unlimited length.
The Spark Series SP-25000-CXP4A of JAI is a 26MP area scan camera capable of providing full resolution images at 150fps.
Fraunhofer IOF’s MWIR 3D Sensor can be used to scan objects in 3D, regardless of whether they are made of transparent plastic or glass.
For applications requiring particularly compact and rigid bearings, Heidenhain presents the MRS angle encoder modules.
Hexagon Manufacturing Intelligence announced the launch of the Absolute Scanner AS1 with an automation-capable data collection speed of 1.2 million points per second and interoperability between portable arm and laser tracker systems.
Baumer’s compact CX camera series (29x29mm) is being expanded with the new up to 24MP Pregius S sensors.
Hikrobot released the second generation of its CS camera series.
The CMOS-based QIS devices of Gigajot Technology has a patented sensor architecture and pixel design to achieve low noise that enables accurate detection of individual photons of light.
The C16090 series of Hamamatsu is an image sensor module (70x70x145mm) with an InGaAs area image sensor (320×256 pixel, 20µm pixel pitch).
With the IRSX Simulator, AT – Automation Technology has developed a software tool to simulate the IRSX smart infrared camera with all its functions on the computer.
Gpixel and Tower Semiconductor announced the GTOF0503 Time of Flight (ToF) sensor, utilizing Tower’s pixel on its 65nm pixel-level stacked BSI CIS technology.
Pleora’s Hybrid AI approach integrates ‘no code’ algorithm development and edge processing to simplify the deployment of end-to-end quality inspections.
Iberoptics has created a family of highly-impact-resistant modules called HarshCam, based on the Sony FCB camera modules that enable the cameras to withstand impacts of 40G for over 11ms and automatically retain focus by keeping the zoom position.
Photolitics has completed the LS2G image sensor family with a line scan sensor 6k model.
Chromasens has introduced a 3D inspection system designed for detecting imperfections on the surface of metal cylinder heads requiring large field of views.
Bicker Elektronik offers coordinated Power+Board bundles consisting of power supply, mainboard and accessories.
The 4200C Hyperspectral Camera by Hinalea Imaging has 300 spectral bands and a spectral resolution of 4nm (FWHM).
Verisurf Software announces the release of its new software version 2023.
Analog Devices announced a high-resolution Time-of-Flight (iToF) module for 3D depth sensing and vision systems.
The 3.5″ embedded board LE-37P7 has an integrated Intel Core i7-11850H processor (Tiger Lake).
Princeton’s Computational Imaging Lab has released a paper about ‘Self-Supervised Depth Estimation from Gated Images’, a new method for generating highly detailed depth maps from a gated camera.
The embedded computer DS-1202 by Cincoze provides high CPU performance to handle machine vision and AI computing tasks.
The ‘Result Processing’ detector on Sensopart’s Vision Sensor Visor allows – thanks to a software update – links to results from previous executions or other jobs.
The MY23F 2.3mm lens by Theia provides a 116° horizontal field of view on a 1/1.8″ sensor without the fisheye or barrel distortion of typical wide-angle lenses.
Itala G is a series of GigE Vision industrial PoE cameras with resolutions ranging from 3.2 to 31MP.