The O3R platform by ifm consists of compact camera heads (VGA cameras and time-of-flight sensors) and a smart AI edge device with Nvidia TX2 for the evaluation of the data.
Opto Engineering’s PCMP series of multi-image 3D objectives are for measuring test objects from 1 to 10mm.
Hamamatsu Photonics’ C15550-20UP is the first camera with a quantitative CMOS (qCMOS) image sensor that can resolve the number of photoelectrons.
The Zenith HZ-21000-G 100GigE camera series by Emergent Vision Technologies enables up to 542fps at 8bit and up to 400fps at 10bit, respectively, thanks to a QSFP28-100GigE interface with its 21MP Gsprint 4521 sensor.
Jetraw by Dotphoton compresses RAW image data without loss of information up to a factor of ten.
The CHRocodile Mini sensor of Precitec performs non-contact distance and thickness measurements in proven accuracy.
The surfaceCONTROL 3D 3500 of Micro Epsilon is a 3D snapshot sensor with a compact design and extremely high resolution in the Z-axis (from 1.0 µm), a repeatability up to 0.4µm and a data processing speed of up to 2.2 million 3D points per second.
Starting in August, IDS will offer three new sensors for the uEye FA cameras: 12MP (IMX226) and 20MP (IMX183) Sony sensors, and the 5MP IMX250MZR polarization sensor.
With the AX Smart Cameras, Baumer presents its first industrial smart cameras.
Two new models join Nikon Metrology’s Nexiv VMZ-S series of CNC video measurement systems.
The Pifoc vertical positioning system for microscope objectives by Physik Instrumente (PI) has been completely revised.
Thanks to a quad-core processor and a just-in-time compiler, vision tasks with B&R Automation’s smart camera will be performed up to four times faster in the future.
The 16MP autofocus USB 3.0 color camera See3cam_160 by e-con Systems is based on the Sony IMX298 sensor with an inbuilt ISP, which also supports multiple levels of digital zoom.
Teledyne Dalsa is introducing the Z-Trak2, a new series of 3D profile sensors that achieve speeds of up to 45,000 profiles/s.
Nvidia’s Jetson AGX Xavier Industrial module enables AI deployment in harsh environments, delivering up to 30 trillion TOPS of AI performance.
The VMT OSC 6D (Object Shape Capture) image processing system by VMT Vision Machine Technic Bildverarbeitungssysteme GmbH enables 3D position recognition of objects and assemblies for guiding manipulators or 6-axis robots.
Aesub offers the Aesub Infinity endless points for 3D scanning of very large components that are quickly placed on large surfaces from the roll.
Hamamatsu Photonics Europe C16741-40U is an InGaAs camera with sensitivity in the visible to near infrared region from 400 to 1700nm.
OPT presents the one-click measurement sensor SmartFlash at Control fair.
Arrow Electronics’ compact (25.0×70.7mm) CYC5000 FPGA board with Arduino-compatible header simplifies the development of IoT edge devices using programmable logic, RISC-V with Altera’s Nios V, DSP accelerators and hardware -IP blocks.
Basler is expanding its product portfolio to include the Stereo visard 3D camera series.
The Fraunhofer Development Center for X-ray Technology, a division of Fraunhofer IIS, has presented a novel testing option for batteries in electric vehicles.
Avnet is presenting two high-end Computer-on-Modules (CoMs) with Intel Core Ultra processors for computing and graphics-intensive applications.
The new addition of Brighter AI´s software is a Full Body Blur feature.
Pekat Vision announces a collaboration with Baumer, introducing the Baumer VAX-50 Smart Camera with the Pekat Vision software.
The new Turtle housing series from autovimation guarantees IP65 protection (IP54 fan) for all camera models up to 100x100mm cross section and lenses up to 120mm diameter, with simultaneous Peltier air conditioning up to +70°C ambient temperature.
At Control, Genesi Elettronica is presenting various programmable multispectral LED lighting systems that work with up to twelve different wavelengths in the range from 400 to 1,650nm.
The Imaging Source announces the launch of IC Measure 4 for Windows.
