Neuheiten Lösungen
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Smart 3D ToF Camera
At the SPS, Contrinex presented a smart 3D camera that will be released in Q2/25.
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Fully automated Sub-Micron X-Ray Inspection
By combining high-resolution 3D X-ray and automated 3D metrology for CoS (chip-on-substrate) solder connections, the Comet Yxlon CA20 enables manufacturers to identify and eliminate systematic yield issues faster than ever…
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Time-of-Flight Sensors with Display
The latest generation of time-of-flight laser sensors from wenglor enables easy configuration thanks to the OLED display and shows the distance value (max.
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Laser Sensor Resistant to Ambient Light up to 50000 Lux
The optoNCDT 5500 laser sensor from Micro-Epsilon is available with four measuring ranges of 10, 25, 100 and 200mm.
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Profile Sensors for Various Colour Surfaces
Eines Vision Systems’ EH2 profile sensor is a versatile profilometer, designed to measure both flush and gap between two panels across a wide variety of materials, with high precision and…
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Software for Metrology Data exchange & Process Management
Zeiss IMT is releasing the new Connected Quality software family.
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CMM Planning Software
The MiCAT Planner software from Mitutoyo enables users to create part programs quickly and easily regardless of their level of knowledge.
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Ring CIS for Transparent and Opaque Tubes
Tichawa Vision´s RingCIS belongs to the Profile Scan family.
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3D Completeness Control for Logistics
Der MIDS (Missing Item Detection Sensor) von Sick erkennt fehlende Artikel in Gebinden wie Kartons, Kisten oder Paletten.















