Creaform is launching two new high-performance scanners. The Handyscan 307|Elite (price 25.400 euros) and Handyscan 700|Elite (price 33.600 euros) with blue laser technology offer additional options for SMEs.
Siemens provides an AI edge solution for wood quality determination using RGB cameras as a data source for quality control and, as an extension, also Hyperspectral Imaging (HSI) for multimodal analysis.
EVK presents the EVK Alpha G100 edge computing platform in combination with the EVK Helios EC32 hyperspectral camera.
CAD2scan, a CAD-based automated inspection planning tool, is the latest feature of the Kitov Smart Planner.
The PACS identification system by Sick recognizes the pallet type based on the branding on the pallet feet and assigns it to a class using a neural network.
The pedestrian proximity detection solution Origin by Arcure Blaxtair benefits from the latest technological advances in both hardware and AI algorithms.
The release 3.7 of the new SDK with Stereolabs’ new Depth Sensing software module based on neural networks for advanced robotics and spatial analytics applications.
Optonic’s PartFinder offers the possibility to load own CAD geometries for bin picking applications and to find them in the point clouds of the Ensenso 3D cameras from IDS.
Liebherr developed the high bin picking solution LHRobotics.Vision which brought together a flexible software solution offering high-quality 3D robot vision that supports using Zivid’s 3D camera family.
Software release 2.6 for the IDS NXT AI vision system focuses on simplified app creation.
The UV cameras fxo487MCX and fxo487MXGE by SVS-Vistek have an 8.1MP sensor by Sony integrated, which enables the detection of invisible product defects through ultra-sharp, high-resolution UV images.
The 3Dpixa compact 15µm camera by Chromasens simultaneously acquires 2D color images and a 3D point clouds or depth maps.
Matrix Vision expands the GigE Vision cameras of the mvBlueCougar family with the UV-sensitive global shutter CMOS sensor IMX487 by Sony.
Built on a multicore platform with hardware acceleration and HDR capability, the Matrix 320 image based reader by Datalogic delivers a large Field of View (FOV) to read multiple labels or codes in a single acquisition with a single reader.
Sony recently released a 247MP rolling shutter CMOS image sensor available in monochrome (IMX811-AAMR) and color (IMX811-AAQR) variants which have a 64.84mm diagonal, a square pixel array, as well as 5.3fps.
The NXT malibu camera from IDS enables AI-based image processing, video compression and streaming in full 4K sensor resolution at 30fps – directly in and out of the camera.
BitFlow has integrated the Nvidia Jetson AGX Orin module with its CoaXPress (CXP) frame grabbers.
The Terascope from the Helmut Fischer Group enables the layer thickness measurement of organic single and multiple layers on any base material with terahertz.
The Computer Vision Toolbox in the 2024a (R2024a) release of the Matlab and Simulink product families from MathWorks provides algorithms, functions and apps for the design and testing of computer vision, 3D vision and video editing systems.
Emergent Vision introduces the expanded real-time 3D/4D reconstruction capabilities within the companie’s eCapture Pro software.
Alkeria’s latest addition to its Celera P camera series, a polarization camera to use dual-USB3 technology, features the 12MP Sony Pregius IMX 253 sensor.
Cognex Corporation’s In-Sight L38 3D Vision System combines AI, 2D, and 3D vision technologies to solve a range of inspection and measurement applications.
The 10GigE camera MV-CH1510-10FM from Hikrobot (distributor Maxxvision) uses Sony’s IMX411 rolling shutter CMOS to transmit images with a resolution of 151MP and 6.2fps.
Teledyne Flir IIS announced SightBase – a Software-as-a-Service (SaaS) platform – that accelerates the design-in cycles for imaging systems.
Starting with a variant that connects to Zebra’s Iris GTX Smart Cameras, Advanced Illumination has developed the LED lighting controller Light Hub.
Aesub offers the Aesub Infinity endless points for 3D scanning of very large components that are quickly placed on large surfaces from the roll.
