The multi spectral sensor AS7343 by ams Osram combines multi-channel color analysis with XYZ sensor technology to measure the color and intensity of light as seen by the human eye.
The multi spectral sensor AS7343 by ams Osram combines multi-channel color analysis with XYZ sensor technology to measure the color and intensity of light as seen by the human eye.
Basler adds an industrial-grade stereo camera series to its product portfolio.
The robot-guided line scan camera by Schäfter + Kirchhoff enables flexible scanning of curved surfaces, e.g.
Polytec’s high-resolution microscope-based white-light interferometer TopMap Micro.View+ provides color information (RGB) from the measured object in addition to height measurement, which simplifies defect assignment.
The COM-HPC Server Carrier Board MSC HS-MB-EV by Avnet Embedded allows access to the new COM-HPC server technology and supports initial lab evaluations, rapid prototyping and early application development.
Thanks to a SerDes adapter board developed by Vision Components and the use of a coaxial cable, cable lengths of over 10m can now be realized with the MIPI-CSI-2 interface.
The release of Neurala’s detection feature is the latest AI model by the company, adding to its existing classification and anomaly recognition capabilities.
Users of the embedded vision system NXT ocean of IDS now have new features at their disposal.
Phoenix Contact is expanding its portfolio of data connectors.
MidOpt introduces the first Acrylic Polarizer, a design that’s thicker and more rugged than the current polarizer film on the market, and more affordable than glass polarizers.
The Nuvo-8111 by Neousys is a cost-effective AI platform designed for factory automation.
The BFPython application programming interface by Bitflow allows engineers with Python expertise to acquire images from BitFlow’s frame grabbers.
The PaintChecker industrial systems by Optisense are designed for fast and non-contact measurement of coating thicknesses in continuous industrial use.
In order to achieve highly accurate 3D measurements, a perfectly coordinated interaction of hardware and software is required.
The Inther Group’s fully automated robotic picking solution Gripp (Gantry Robotic Intelligent Piece Picker) was developed with the aim of increasing picking throughput.
The Zeiss Automated Defect Detection (ZADD) software by Zeiss IMT makes it possible to detect even small and fuzzy defects in components reliably, quickly and automatically.
For users of Teledyne Flir fixed thermal camera solutions the Geva 400 iNspect package of Teledyne Dalsa is a simple and affordable solution.
The scanControl AIK adapter by Micro Epsilon enables integration into Cognex VisionPro via the Cognex AIK Server.
The FSM-IMX570 development kit by Framos provides vision system engineers with a framework for developing a working prototype of an indirect Time-of-Flight embedded vision system.
The 2.3MP full HD camera VM-20 with global shutter and MIPI CSI-2 – interface complements Phytec’s camera models with 1 and 5MP resolution and offers up to 120fps in full resolution.
The ECX-3000-PEG by Vecow (sales plug-in) is designed for highest computing performance and AI applications and supports up to 6656 CUDA cores, 52 RT cores and 208 tensor cores.
The NXT 3.0 software update by IDS now also enables anomaly detection for the smart NXT cameras.
The 5.2MP vision sensor VOS5000-F227-C-S by Pepperl+Fuchs with interchangeable C-mount lens offers a wide range of detection tools for flexible inspection tasks.
Based on the latest Intel Core Mobile processors of the 12th and 13th generation, the TQ Group is expanding its range in the CPU power ranges 15, 28 and 45W with the COM-Express compact modules TQMx120 and TQMx130.
Adlink’s AI Camera Development Kit simplifies prototyping and testing of edge AI vision systems.
Mikrotron’s 10MP EoSens 10CCX12-FM CXP-12 camera with global shutter takes full advantage of the maximum performance of the Gsprint 4510 CMOS sensor, allowing color images to be captured at up to to 478fps.